独立存储器
SPI接口(for High Reliability Use, AEC-Q100 Compliant)
| 产口型号 |
存储器密度 |
电源电压 |
工作频率 （最大值） |
工作温度 |
读取/写入 周期 |
封装 |
| MB85RS256TY (AEC-Q100) ENG(1.60 MB ) |
256Kbit |
1.8 to 3.6V |
40MHz |
-40 to +125℃ |
1013 (10 trillion) times |
SOP-8 |
| MB85RS128TY (AEC-Q100) ENG(1.61 MB ) |
128Kbit |
SPI接口 (for General Use)
| 产口型号 |
存储器密度 |
电源电压 |
工作频率 （最大值） |
工作温度 |
读取/写入周期 |
封装 |
| MB85RS4MT ENG(1.50 MB ) |
4Mbit |
1.8 to 3.6V |
40MHz |
-40 to +85℃ |
1013 (10 trillion) times |
SOP-8 |
| MB85RQ4ML ENG(1.99 MB ) |
1.7 to 1.95V |
108MH |
SOP-16 |
|||
| MB85RS2MTA ENG(1.08 MB ) |
2Mbit |
1.8 to 3.6V |
33MHz(*2) | SOP-8, DIP-8 |
||
| MB85RS2MT ENG(1.42 MB ) CHN(1.28 MB ) |
25MHz(*1) |
|||||
| MB85RS1MT ENG(1.88 MB ) CHN(2.42 MB ) |
1Mbit |
30MHz(*1) |
SOP-8, WL-CSP |
|||
| MB85RS512T ENG(1.38 MB ) CHN(2.16 MB ) |
512Kbit | SOP-8 |
||||
| MB85RS256TY (for General Use) ENG(1.74 MB) |
256Kbit | 33MHz |
||||
| MB85RS256B ENG(1.38 MB ) CHN(2.00 MB ) |
2.7 to 3.6V |
-40 to +125℃ | 1012 (1 trillion) times |
|||
| MB85RS128TY (for General Use) ENG(1.59 MB) |
128Kbit |
1.8 to 3.6V |
-40 to +85℃ |
1013 (10 trillion) times |
||
| MB85RS128B ENG(1.36 MB ) CHN(2.00 MB ) |
2.7 to 3.6V |
-55 to +85℃ |
||||
| MB85RS64TU ENG(1.59 MB ) |
64Kbitt |
1.8 to 3.6V | 10MHz |
-40 to +85℃ |
1012 (1 trillion) times |
SOP-8 SON-8 |
| MB85RS64T ENG(1.58 MB ) |
1013 (10 trillion) times |
SOP-8 ON-8 |
||||
| MB85RS64V ENG(1.34 MB ) CHN(1.96 MB ) |
33MHz | 1012 (1 trillion) times |
SOP-8 |
|||
| MB85RS64 ENG(1.25 MB ) CHN(1.96 MB ) |
2.7 to 3.6V |
20MHz |
||||
| MB85RS16 ENG(1.31MB ) CHN(2.04 MB ) |
16Kbit | |||||
| MB85RS16N ENG(1.42 MB ) CHN(2.17 MB ) |
-40 to +95℃ |
1012(1 trillion) times at 85℃, 1010(10 billion) times at 95℃ |
SOP-8 SON-8 |
|||
MB85RDP 16LX(*2) ENG(492 KB) |
1.65 to 1.95V | 15MHz |
-40 to +105℃ |
1013 (10 trillion) times |
SOP-8 |
*1:Maximum 40MHz operation is available at fast read mode.
*2:With binary counter function.
*3:Maximum 7.5MHz operation is available at DualSPImode.
并行存储器
| 产口型号 |
存储器密度 |
电源电压 |
工作频率 （最大值） |
工作温度 |
读取/写入周期 |
封装 |
| MB85R8M2T (1.11 MB ) |
8Mbit (512K×16) |
1.8 to 3.6V |
150ns |
-40 to +85℃ |
1013 (10 trillion) times |
FBGA-48 |
| MB85R4M2T (1.09 MB ) |
4Mbit (256K×16) |
1010 (10 billion) times |
TSOP-44 |
|||
| MB85R4001A (972 KB) (1.29 MB ) |
3.0 to 3.6V |
TSOP-48 |
||||
| MB85R4002A (1,005 KB) (1.53 MB ) |
||||||
| MB85R1001A (969 KB) (1.30 MB ) |
1Mbit (128K×8) |
|||||
| MB85R1002A (1,001 KB ) (1.32 MB ) |
1Mbit (64K×16) |
|||||
| MB85R256F (1.10 MB ) (2.30 MB ) |
512Kbit (32K×8) |
2.7 to 3.6V | 1012 (1 trillion) times |
TSOP-28, SOP-28 |
FRAM产品阵列
未来我们还将通过技术来发来提高一些技术规格，如工作电压和存取速度，并提供多种产品。富士通半导体能够利用其它公司不能提供的富士通独有技术，提供广泛的单独FRAM产品。
4Kb至4Mb产品现已投入量产。
富士通正在为客户评估提供工程研发样品或生产样品。请确认我们的FRAM产品阵列，如果您想获得样品 ，请填写“FRAM样品/文档申请咨询表”申请样品和/或文件。
* 链接至每个数据手册，表格中的产品名称。
FRAM 样品/文件申请和咨询表格
申请评估样品和/或文件，如数据手册，宣传册等
针对一般性的问题，如技术咨询，样品情况，定价等
评论