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公司名称:AMKOR
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ETCSP
the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
AMKOR
LQFPPOWERQUAD4
LQFP PowerQuad
AMKOR
CBGA
From innovative designs and expanding package offerings, Amkor provides a
AMKOR
FCCSP
a flip chip solution in a CSP package format.
AMKOR
MCMPBGA
Innovative designs and expanding package offerings provide a platf
AMKOR
PBGA
Innovative designs and expanding package offerings provide a platf
AMKOR
CABGA
ChipArray
AMKOR
CDIP
Ceramic Dual-Inline Package
AMKOR
CERDIP
Ceramic Dual-Inline Package
AMKOR
CERPAK
Ceramic Pack
AMKOR
CLGA
Ceramic Land Grid Array Package
AMKOR
CMCM
Ceramic Multi-Chip Module Package
AMKOR
CPGA
Ceramic Pin Grid Array Package
AMKOR
CQFP
Ceramic Quad Flat Pack Package
AMKOR
CSOIC
Ceramic Small Outline Integrated Circuit Package
AMKOR
CSPNL
Wafer Level Packaging
AMKOR
CSSOP
Ceramic Shrink Small Outline Package
AMKOR
CTBGA
ChipArray
AMKOR
CVBGA
ChipArray
AMKOR
FLATPACK
Ceramic Flat Pack Package
AMKOR
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