器件名称: AND4GRA
功能描述: InGaN Ultra Bright Green Light Emission Surface Mount Package
文件大小: 66.37KB 共2页
简 介:AND4GRA
Ultra Bright LED Lamps: Type 2
Weight: 2.0 mg Unit: mm
AND4GRA
InGaN Ultra Bright Green Light Emission Surface Mount Package
Features
Small package size 2.0 (l) x 1.25 (w) x 1.1 (h) size Suitable for DIP and REFLOW soldering Recommended Forward Current: 10 mA RoHS Compliant Maximum Ratings (Ta = 25°C)
Characteristics Forward Current Reverse Voltage
Product specications contained herein may be changed without prior notice. It is therefore advisable to contact Purdy Electronics before proceeding with the design of equipment incorporating this product.
Symbol
IF VR PD TOpr TStg
Rating
30 5 120 -30 to 80 -40to 100
Unit
mA V mW °C °C
Power Dissipation Operating Temp. Range Storage Temp. Range
Electro-Optical Characteristics (Ta = 25°C)
Characteristics Forward Voltage Reverse Current Luminous Intensity Peak Emission Wavelength Spectral Line Half Width Dominant Wavelength Full Viewing Angle
Precaution
Symbol
VF IR IV lP l ld 2 q 1/2
Test Condition
IF = 20 mA VR = 5 V IF = 20 mA IF = 20 mA IF = 20 mA IF = 20 mA IF = 20 mA
Minimum
3.1 – 84 – – – –
Typical
3.5 – 140 540 45 530 120
Maximum
3.8 100 – – – – –
Unit
V A mcd nm nm nm degree
Please be careful of the following: 1. Manual soldering: maximum temperature of iron tip: 260°C max. Soldering time: within 5 sec. per solder-land Soldering portion of lead: up to 1.6 mm from the body of the device 2. Reflow solder: recommended condition is as follows:
10 sec. max. Temperature 140 - 160°C 230°C max.
3. Absolute ……
