解剖新一代火蝠 镭波F620笔记本全拆解
![](http://m.amcfsurvey.com/editerupload/201404/920a4cb3989a34c402bf950768fbeec9.jpg)
▲键盘底部支架
![](http://m.amcfsurvey.com/editerupload/201404/d6d7592390b5a835e07b3044fe48c954.jpg)
▲键盘支架背面
![](http://m.amcfsurvey.com/editerupload/201404/26ba89e72fea872a1e5858843946f3a9.jpg)
![](http://m.amcfsurvey.com/editerupload/201404/a4e5669d2ff571e8cea7d627c88ade4c.jpg)
▲Intel Core i7 740QM处理器
![](http://m.amcfsurvey.com/editerupload/201404/b56d6a4dc31b818ac575a8ed4ff1d0e7.jpg)
▲NVIDIA GeForce GTX 460M显卡(1.5GB 192bit GDDR5)
![](http://m.amcfsurvey.com/editerupload/201404/501bc3ccdc9afdac6baacac4ad371929.jpg)
▲NVIDIA GeForce GTX 460M显卡背面
![](http://m.amcfsurvey.com/editerupload/201404/f55b9fac53d2fc8f81a49712c2a25ed9.jpg)
▲3XSamsung2GB DDR3 1333内存
![](http://m.amcfsurvey.com/editerupload/201404/aaa4acacc1aa4c8ee013595ef6c59f84.jpg)
▲Intel Ibex Peak-M PM55主板
![](http://m.amcfsurvey.com/editerupload/201404/7679e5e0ed76b26e7d6c37708583f564.jpg)
▲Intel Ibex Peak-M PM55主板背面
![](http://m.amcfsurvey.com/editerupload/201404/efdb2c0ee224d997ba2995f4207e9763.jpg)
▲Intel Ibex Peak-M PM55芯片
![](http://m.amcfsurvey.com/editerupload/201404/90ac9932cccd5096ca84212942baf74b.jpg)
![](http://m.amcfsurvey.com/editerupload/201404/fdc991b1789b401a5507b9a981de79ef.jpg)
![](http://m.amcfsurvey.com/editerupload/201404/0ce17b0d4d6f304c459d05015f8f6f71.jpg)
![](http://m.amcfsurvey.com/editerupload/201404/4f1c5ad26d8c104f40a15bff442b3335.jpg)
▲主板扩展接口
![](http://m.amcfsurvey.com/editerupload/201404/e721525ebd80cc375bd7fa3dd3516b1d.jpg)
▲处理器散热片
![](http://m.amcfsurvey.com/editerupload/201404/2829906ab8b1a6a4f6e79a253af7195a.jpg)
▲处理器散热片底部
![](http://m.amcfsurvey.com/editerupload/201404/f967cb5e4dbee4bca936b18de5d0fbb2.jpg)
▲显卡散热器顶部
![](http://m.amcfsurvey.com/editerupload/201404/81d9b32794d0b2ba847ceb1e4028b0f3.jpg)
▲显卡散热器底部
![](http://m.amcfsurvey.com/editerupload/201404/b1d8df43f476fe2b74cdbe3b372b2e82.jpg)
▲0.36mA/12V风扇
![](http://m.amcfsurvey.com/editerupload/201404/3cc90e0edf3bb5294bfbb07b9fb84c8b.jpg)
▲Hitachi 500GB 7200转SATA硬盘
![](http://m.amcfsurvey.com/editerupload/201404/94b447f4b930ac62bfd972c2f404b8a8.jpg)
▲TSSTcorp DVD刻录光驱
![](http://m.amcfsurvey.com/editerupload/201404/02683d53186bec6c85c6098f8e92dd80.jpg)
▲SATA扩展接口模块
![](http://m.amcfsurvey.com/editerupload/201404/6b37b62d0724e313ac4fe5ef888991e3.jpg)
▲Realtek RTL8188CE无线网模块
![](http://m.amcfsurvey.com/editerupload/201404/65b2c19ca12420d721587ae95396727b.jpg)
▲NEC D720200F1 USB3.0控制芯片
![](http://m.amcfsurvey.com/editerupload/201404/7eeeb2d27414cbcae8f17b97bef51ea7.jpg)
▲Realtek RTL8111网络芯片
![](http://m.amcfsurvey.com/editerupload/201404/72321eb015dc1535fe509df4844a3f03.jpg)
由先前的测试成绩我们已经可以看出,镭波F620笔记本在性能上更多的是突出了产品的实用性。而通过此次的拆借我们也了解到,虽然镭波F620在模具用料和做工方面较同方以往的产品没有太多优势可言,但在核心部件的选择上却是秉承了镭波一贯的严谨,这也令该产品在保证了较高硬件规格的同时,在日常的高负荷运行中具有更好的稳定性。
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