intersil的D16.3 — Mil-Std-1835 CDIP2-T16(D-2,Config C)16脚金锡盖双列直插封装管壳(SBDIP)封装

D16.3 — Mil-Std-1835 CDIP2-T16(D-2,Config C)16 Lead Ceramic Dual-In-Line Metal Seal PKG
Hermetic Packages for Integrated Circuits

Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
c1 LEAD FINISH D16.3 MIL-STD-1835 CDIP2-T16 (D-2, CONFIGURATION C)
-A- -D- 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE

BASE INCHES MILLIMETERS
(c)
METAL
E SYMBOL MIN