intersil的D8.3 — Mil-Std-1835 CDIP2-T8(D-4,Config C)8 脚金锡盖双列直插封装管壳(SBDIP)封装

D8.3 — Mil-Std-1835 CDIP2-T8(D-4,Config C)8 Lead Ceramic Dual-In-Line Metal Seal PKG
Hermetic Packages for Integrated Circuits

Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
c1 LEAD FINISH D8.3 MIL-STD-1835 CDIP2-T8 (D-4, CONFIGURATION C)
8 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
-A- -D-
BASE INCHES MILLIMETERS
(c)
METAL SYMBOL MIN MAX MIN MAX