器件名称:
ST14C02C
功能描述:
Memory Micromodules General Information for D1, D2 and C Packaging
文件大小:
277.48KB 共13页
简 介:
D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging s Micromodules were developed specifically for embedding in Smartcards and Memory Cards The Micromodule provides: – Support for the chip – Electrical contacts – Suitable embedding interface for gluing the module to the plastic package potting side contact side s D15 s Physical dimensions and contact positions compliant to the ISO 7816 standard Micromodules delivered as a continuous Super 35 mm tape. (This differs from the standard 35 mm tape in the spacing distance between the indexing holes.) D10 D20 1 1 1 1 s 1 1 1 1 DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). The plastic card is made of PVC, ABS or similar material, and can be over-printed with graphics, text, and magnetic strips. The Micromodule is embedded in a cavity in the plastic card. The Micromodules are mounted on Super 35 mm metallized epoxy tape, and are delivered on reels. These contain all of the chips from a number of wafers, including those chips that were found to be non-functioning during testing. Traceability is ensured by a label fixed on the reel. D22 C30 C20 Table 1. Memory Card and Memory Tag Integrated Circuits Modul e D10 D15 D20 D22 C30 C20 Please see the data briefing sheets of these products for example illustrations of these micromodules ST1200, ST1305B, ST1331, ST1333, S……
