器件名称:
TT-SMDC
功能描述:
SURFACE MOUNT MICROPROCESSOR CRYSTAL
文件大小:
34.54KB 共1页
简 介:
SURFACE MOUNT MICROPROCESSOR CRYSTAL FEATURES AT CUT CRYSTAL PERFORMANCE THERMOPLASTIC PACKAGE SUITED FOR REFLOW SOLDERING EXCELLENT FOR HIGH DENSITY CIRCUIT BOARDS SERIES TT-SMDC SPECIFICATIONS MODEL TYPE FREQUENCY RANGE MODE OF OSCILLATION FUNDAMENTAL THIRD OVERTONE FREQUENCY TOLERANCE AT 25 C FREQUENCY STABILITY OVER TEMPERATURE TEMPERATURE RANGE LOAD CAPACITANCE SHUNT CAPACITANCE EQUIVALENT SERIES RESISTANCE (ESR) DRIVE LEVEL SHOCK RESISTANCE REFLOW CONDITIONS OPERATING EXTENDED TT-SMDC 3.579545 MHz TO 70.000 MHz 3.579545 MHz TO 30.000 MHz 30.10 MHz TO 70.000 MHz ±50 PPM MAX ( ± 30 PPM AVAILABLE) ±50 PPM MAX ( ± 30 PPM AVAILABLE) -10 C TO +60 C -40 C TO +85 C 12 pF TO 32 pF OR SERIES 7 pF MAXIMUN SEE TABLE 1 100 W MAXIMUM ±5 PPM MA XIMUM 75 cm DROP TEST IN 3 AXES ONTO A HARD SURFACE OR 3000 g/0.3 ms x ‰ SINEWAVE IN 3 AXES 240 C FOR 10 S MAXIMUM FREQUENCY (MHz) 3.50 TO 3.999 4.00 TO 5.999 6.00 TO 9.999 10.00 TO 30.00 30.10 TO 90.00 TABLE 1 MODE FUNDAMENTAL FUNDAMENTAL FUNDAMENTAL FUNDAMENTAL THIRD OVERTONE MAXIMUM ESR (OHM) 200 150 100 50 100 REFLOW SOLDERING PROFILE 240 C – 5 REFLOW TEMPERATURE 10 s 150 C PREHEATING 100 s COOLING OUTLINE DRAWINGS mm inch Scale none Dimension in 25 C 180s MAX TIME (SECONDS) 4 M A R K IN G A R E A 3 1.8 .071 1.8 .071 CARRIER TAPE DIMENSIONS 1.8 .071 1.7 .067 1 12.5 M A X .492 M A X 9.4 .370 3.7 M A X .146 M A X 2 4.6 M A X .181 M A X 12.8 .504 24 .945 4.8 .189 12.0 .472 5.0 .197 0.8 .03 0.8 .03 PACKAGING PART NUMBERI……
