器件名称:
MH16083N9DL
功能描述:
MULTILAYER CHIP INDUCTOR
文件大小:
393.1KB 共5页
简 介:
SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 1 MULTILAYER CHIP INDUCTOR CONFIGURATION & DIMENSIONSG A ABC'S DWG NO. ABC'S ITEM NO. MH1608□□□□L□-□□□ O A B B C D D : : : : 1.60±0.15 0.80±0.15 0.80±0.15 0.30±0.20 m/m m/m m/m m/m O SCHEMATIC DIAGRAMG O FEATURESG aO Monolithic structure ensuring high performance and reliability. bO High frequency applications up to 6GHz. cO TerminalG Ag/Cu/Ni/Sn dO RemarkG Products comply with RoHS' requirements O APPLICATIONSG aO RF modules for telecommunication systems including GSM, PCS,DECT,WLAN,Bluetooth,etc. Peak TempG 260J max. Max time above 230J G 50sec max. Max time above 200J G 70sec max. Temperature Rising Area +4.0J / sec max. Preheat Area 150 ~ 200J / 60 ~ 120sec Reflow Area +2.0 ~ 4.0J / sec max. Forced Cooling Area -(1.0 ~ 5.0)J / sec max. Peak Temperature: 260J 50sec max. 230J O GENERAL SPECIFICATIONG aO Storage temp.G -55J ---- +125J bO Operating temp.G -55J ---- +125J cO SolderabilityG Preheat 150J . 60 sec SolderG H63A Solder temp.G 230±5J FluxG Rosin Dip timeG 4±1 sec Temperature ( J ) C 250 200 150 70sec max. 100 50 0 50 100 150 Time ( seconds ) 200 250 AR-001A SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 2 MULTILAYER CHIP INDUCTOR ELECTRICAL CHARACTERISITCSG DWG No. Inductance ( nH ) 1.0 ± 0.3 1.2 ± 0.3 1.5 ± 0.3 1.8 ± 0.3 2.2 ± 0.3 2.7 ± 0.3 3.3 ± 0.3 3.9 ± 0.3 4.7 ± 0.3 5.6 ± 0.3 6.8 ± 5% 8.2 ± 5% 10.0 ± 5% 12.0 ± 5% 15.0 ± 5% 18.0 ± 5% 22.0 ± 5% 27.0 ± 5% 33.0 ± 5% 39.0 ± 5% 47.0 ± 5……
