器件名称:
74696-2514
功能描述:
2.00 by 2.25mm (.079 by .089"") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane Connector System
文件大小:
609.88KB 共2页
简 介:
FEATURES AND SPECIFICATIONS Features and Benets s s s s s s Up to 5.0 Gbps bandwidth per signal pair enables state-of-the-art system design and performance 2.00 by 2.25mm (.079 by .089”) pitch provides real signal density of 10 differential pairs for 5-row and 6-row and 15 differential pairs for 8-row per centimeter (25 and 38 pairs respectively per inch) Minimum distance between daughtercards: – 5-row system offers 15.00mm (.591") – 6-row system offers 18.00mm (.709") – 8-row system offers 22.00mm (.866") Ground planes between signal columns provide tightly controlled impedance for rise times down to 50 picoseconds (10-90%). This ensures very low cross talk between signals within and between columns Ground pins are in the same grid as signal pins, allowing wider channels for PCB routing and traces up to 0.25mm (.010”) wide 6-row or 8-row VHDM-HSD wafers can be applied to the same stiffener as standard VHDM 6-row or 8row wafers. The combination of VHDM and VHDMHSD wafers, grouped together in the same stiffener, provides cost effective solutions to different performance parameters 2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane Connector System The daughtercard connector consists of a metal stiffener just as with the VHDM system. The system combines the signal wafers, power modules and guidance modules into one continuous connector that can be ordered as a single specic part number. The card pitch of the VHDMHSD 8-row system is t……
