器件名称:
LC25WC153AGJ57
功能描述:
2.5 Gb/s CWDM Buried Het Laser 80Km reach
文件大小:
220.02KB 共5页
简 介:
Data Sheet 2.5 Gb/s CWDM Buried Het Laser 80Km reach LC25WC This laser module provides a fast route to CWDM by providing a drop in replacement on existing TDM or WDM circuit packs with minimum redesign and verification work. The product employs the Bookham strained layer MQW Buried Heterostructure DFB laser chip, and has been designed specifically for use in Coarse Wavelength Division Multiplexed (CWDM) 2.5 Gb/s optical fibre trunk systems. The device is packaged in a hermetic 14-pin butterfly package incorporating an isolator and monitor photodiode for control of the power of the laser over life and all operating conditions. The device is available with a number of power options depending on application and link span requirements. Features: Drop in replacement onto TDM and WDM card 2.5 Gb/s operation Up to 10mW optical output power available Narrow spectral line-width Internal TEC with precision NTC thermistor for temperature control 1470nm to 1610nm at 20nm compliant to ITU G.694.2 Code reduction with single product for reaches up to 80km GaInAsP SLMQW DFB single frequency laser chip InGaAs monitor photodiode Hermetically sealed 14-pin butterfly package with optical isolator RoHS compliant Applications: CWDM metro 1 Data Sheet Parameters Parameter Threshold current (Ith) Slope efficiency by product 2 mW 3 mW 4 mW 10 mW [1] Conditions Min Typ 10 Max 22 0.09 0.13 0.17 0.43 -10 Unit mA mW/mA 0.04 0.06 0.08 0.143 RF input reflection coef (S11) Forward v……
