EEPW首页| 器件索引| 厂商列表| IC替换| 微缩略语| 电路图查询
器件查询:
400万器件资料库等您来搜!
首页>SPANSION> AM70PDL127CDH66I

AM70PDL127CDH66I

器件名称: AM70PDL127CDH66I
功能描述: Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage Mi
文件大小: 1914.12KB 共127页
生产厂商: SPANSION
下  载: 在线浏览点击下载
简  介: ……
相关电子器件
器件名 功能描述 生产厂商
AM70PDL127CDH66IT Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage Mi SPANSION
AM70PDL127CDH66IS Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage Mi SPANSION
AM70PDL127CDH66I Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage Mi SPANSION
Am70PDL127CDH66IT 2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS AMD
Am70PDL127CDH66IS 2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS AMD
《电子产品世界》杂志社 版权所有 北京东晓国际技术信息咨询有限公司
Copyright ©2002 ELECTRONIC ENGINEERING & PRODUCT WORLD. All rights reserved.
京ICP备12027778号-2