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通富微电测试技术

作者: 时间:2022-04-18 来源:通富微电 收藏

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Production Overview

TFME offers various WBBGA and WBLGA package based on customer different requirement.




Features
- 1.1x0.7 mm to 21x21 mm Package
- 0.2mm to 1.0mm C Mold Chase
- 01005 Components SMT
- 0.3x0.3 mm Small Die
- 1-6 Layer Substrate


Process Capability & Design Rule


Reliability Test Standards



Shipment Packing









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