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【应用手册】Thermal Management and Mechanical Handling for Altera FCmBGA Devices

bobgeng
高工
2012-04-23 10:16:12 打赏
【应用手册】Thermal Management and Mechanical Handling for Altera FCmBGA Devices
This application note describes the thermal composite flip chip molded ball-grid array
(FCmBGA) package for the Arria V device family.
FCmBGA improves board real-estate use by allowing closer spacing between passive
components and the flip chip die, providing better warpage control for thin core
substrates, and improving solder joint reliability. an657.pdf
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关键词： 应用 手册 Thermal Management

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