首页 | 嵌入式系统 | 显示技术 | 模拟IC/电源 | 元件与制造 | 其他IC/制程 | 消费类电子 | 无线/通信 | 汽车电子 | 工业控制 | 医疗电子 | 测试测量
首页> 分享下载> 消费类电子> 高速模拟设计中电路板寄生效应测试

高速模拟设计中电路板寄生效应测试

资料介绍
高速模拟设计中电路板寄生效应测试Application Report
SBOA094 - August 2003

Measuring Board Parasitics in High-Speed Analog Design
Rea Schmid ABSTRACT Successful circuit designs using highspeed amplifiers can depend upon understanding and identifying parasitic printed circuit board (PCB) components. Simulating a design while including PCB parasitics can protect against unpleasant production surprises. This application report discusses an easy method for measuring parasitic components in a prototype or final PC board design by using a standard oscilloscope and low frequency waveform generator to collect valuable information for SPICE simulation. High Speed Products

Contents 1 2 3 4 High Speed Circuit Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
标签: 高速模拟设计中电路板寄生效应测试
高速模拟设计中电路板寄生效应测试
本地下载

评论