SITRI iPhone 7 Plus 技术全解析
![](http://editerupload.eepw.com.cn/201609/e8d8c9761eb0ae857f75f5cd86fbc8e9.jpg)
MEMS Die Mark
![](http://editerupload.eepw.com.cn/201609/47d990b4903d26f29b02227eb0aebd6d.jpg)
MEMS麦克风
iPhone7 Plus的4个麦克风中有一颗来自STMicroelectronics,2颗来自楼氏,还有1颗来自歌尔声学。
麦克风1(位于手机顶部-正面)
麦克风1来自STMicroelectronics,封装尺寸为3.30 mm x 1.95 mm x 0.77 mm。
![](http://editerupload.eepw.com.cn/201609/05a177a4b8519f87aed15daa3842e9c8.jpg)
Package Photo
![](http://editerupload.eepw.com.cn/201609/f89d7cd122ca21fd71bc98907845df86.jpg)
Package Cap Removed Photo
![](http://editerupload.eepw.com.cn/201609/1e29e692370a75c66aebf6469e958197.jpg)
Package X-Ray Photo
![](http://editerupload.eepw.com.cn/201609/ac3d49ad1ec2f5937cbd82bf37c10e8e.jpg)
![](http://editerupload.eepw.com.cn/201609/a7824049b82bd4e4f080e43e5d327744.jpg)
ASIC Die Photo
![](http://editerupload.eepw.com.cn/201609/4beffc104e44260632129524ba939b02.jpg)
ASIC Die Mark
![](http://editerupload.eepw.com.cn/201609/3dc4616696279de99eb9028729c11c1d.jpg)
MEMS Die Photo
![](http://editerupload.eepw.com.cn/201609/e3c9c4be4845068b8ee1f0a86703faa2.jpg)
MEMS Die Mark
![](http://editerupload.eepw.com.cn/201609/de0490196893c41f5d054a84ff155e45.jpg)
MEMS Die SEM Sample
![](http://editerupload.eepw.com.cn/201609/6ab95b1b3c6a261c37d8cf40631a9df9.jpg)
![](http://editerupload.eepw.com.cn/201609/6ecdaec373fd5cdf46ca79f15bb848db.jpg)
麦克风2(位于后置摄像头旁)
麦克风2来自楼氏,封装尺寸为3.25 mm x 1.90 mm x 0.77 mm。
![](http://editerupload.eepw.com.cn/201609/fb49ed59e2e181f55a9613a0e53fe65b.jpg)
Package Photo
![](http://editerupload.eepw.com.cn/201609/945ae729a55de76942438f3345efdc2b.jpg)
Package Cap Removed Photo
![](http://editerupload.eepw.com.cn/201609/f8510fc8c2f0ea44972b77ed9faeeb7a.jpg)
Package X-Ray Photo
![](http://editerupload.eepw.com.cn/201609/a4dfdba1adf274c482186b4455cc75a8.jpg)
![](http://editerupload.eepw.com.cn/201609/ef7eab70725a2a1f15a017b0283ea7c5.jpg)
MEMS Die Photo
![](http://editerupload.eepw.com.cn/201609/13e3ed85e5a249177dbe8c8e2ec94d9d.jpg)
MEMS Die Mark
![](http://editerupload.eepw.com.cn/201609/de2e2c29a3c5849ce2d1cb63520d4b95.jpg)
麦克风3(位于手机底部)
麦克风3也来自楼氏,封装尺寸为3.25 mm x 1.90 mm x 0.75 mm。MEMS Die同麦克风2相同,ASIC Die从现有的数据上看,在尺寸和Bonding线上有一定区别。
![](http://editerupload.eepw.com.cn/201609/01f60e4260e35a1f7eba5e4502a525cb.jpg)
Package Photo
![](http://editerupload.eepw.com.cn/201609/87304e78551b66183e3d7a572844271e.jpg)
Package Cap Removed Photo
![](http://editerupload.eepw.com.cn/201609/9fae0cef61e968f7334f430ebf3f1c48.jpg)
Package X-Ray Photo
![](http://editerupload.eepw.com.cn/201609/0f8f6ed6db9b9c811d230eb073da8c87.jpg)
![](http://editerupload.eepw.com.cn/201609/b084d11356d08f0cef17a5bf2d180cc7.jpg)
麦克风3的MEMS Die Photo同麦克风2相同,这里就不加图片描述。
麦克风4(位于手机底部)
麦克风4来自歌尔声学,封装尺寸为3.30 mm x 1.95 mm x 0.78 mm。
![](http://editerupload.eepw.com.cn/201609/0160a9be0e9e00629b65ddd7b961e502.jpg)
Package Photo
![](http://editerupload.eepw.com.cn/201609/4bfd487e228ba8467ff2a72aed7d4657.jpg)
Package Cap Removed Photo
![](http://editerupload.eepw.com.cn/201609/0af511792c8e594062e282a48e99bd2a.jpg)
Package X-Ray Photo
![](http://editerupload.eepw.com.cn/201609/8fb46c1e4a84b744069e99a1c3717b52.jpg)
![](http://editerupload.eepw.com.cn/201609/4bb7ed51cd25df9728c3f97863d4d1a1.jpg)
MEMS Die Photo
![](http://editerupload.eepw.com.cn/201609/dfbbc51ef881977a9551d1bca8fa6114.jpg)
综上所述,iPhone7 Plus中依然未出现心率传感器,而其他的传感器芯片都较之前的产品有所更新,特别是使用了集成的距离传感器取代之前的分立器件,后续我们会对iPhone7 Plus中的A10处理器、指纹模组、双摄像头、距离传感以及整机设计等做进一步的详细解析,敬请关注!
评论