器件名称:
SM1316-D
功能描述:
Chip LED Lamp
文件大小:
263.37KB 共4页
简 介:
Semiconductor SM1316-D Chip LED Lamp Features 1.6mm(L)×0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip led Applications LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp Outline Dimensions unit : mm KLM-4000-000 1 SM1316-D Absolute maximum ratings Characteristic Power Dissipation Forward Current * Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature 2 1 Symbol PD IF IFP VR Topr Tstg Ratings 70 25 50 4 -2580 -30100 Unit mW mA mA V ℃ ℃ 240℃ for 5 seconds * Soldering Temperature Tsol *1.Duty ratio = 1/16, Pulse width = 0.1ms *2.Recommended soldering Temperature Profile (Reflow Soldering) Temp(℃) Peak Temp max 1~ 4℃/sec 220℃ 140~ 160℃ Preheating area 120 1~4℃/sec Time(sec) Solder area max. 50sec Peak time max 10sec 240℃ -2~ -6℃/sec Electrical Characteristics Characteristic Forward Voltage * Luminous Intensity * Peak Wavelength Spectrum Bandwidth Reverse Current *3Half angle θ1/2 5 4 Symbol VF IV λP Δλ IR X Y Test Condition IF= 10mA IF= 10mA IF= 10mA IF= 10mA VR=4V IF= 10mA Min 6.6 - Typ 2.0 15 572 30 ±65 ±70 Max 2.6 27 10 - Unit V mcd nm nm uA deg *3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity *4. Luminous Intensity Maximum tolerance for each Grade Classification limit is ±18% *4. Luminous Intensity classification F 6.6~10 G 10~17 H 17~27 *5. Peak Wavelength Maximum……
