器件名称:
SM1316-D
功能描述:
Chip LED
文件大小:
201.98KB 共5页
简 介:
Semiconductor SM1316-D Chip LED Features 1.6mm(L)×0.8mm(W) small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip led Applications LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp Outline Dimensions unit : mm KSD-O8G022-001 1 SM1316-D Absolute Maximum Ratings Characteristic Power dissipation Forward current * Peak forward current Reverse voltage Operating temperature range Storage temperature range 1 (Ta=25oC) Symbol PD IF IFP VR Topr Tstg Rating 58 25 50 4 -2580 -30100 Unit mW mA mA V ℃ ℃ *2Soldering temperature Tsol 240℃ for 10 seconds *1.Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended reflow soldering temperature profile - Preheating 150℃ to 185℃ within 120 seconds soldering 240℃ within 10 seconds Gradual cooling (Avoid quenching) Temp (℃) 240 Peak Temp max. 240℃ Preheating area 150~185℃, 90±30sec 185 150 max. 3℃/sec max. 4℃/sec Time from 25℃ to Peak Temperature max. 6min 0 60 150 180 240 Time (sec) max. -6℃/sec max. 10sec Solder area 220℃, max. 60sec 25 Electrical / Optical Characteristics Characteristic Forward voltage * Luminous intensity Peak wavelength Spectrum bandwidth Reverse current *4Half angle θ1/2 3 (Ta=25oC) Symbol VF IV Test Condition IF= 10mA IF= 10mA IF= 10mA IF= 10mA VR=4V Min 1.8 6 569 - Typ 573 30 ±65 ±70 Max 2.3 27 578 10 - Unit V mcd nm nm uA deg λP λ IR X Y IF= 10mA KSD-O8G022-001 2 SM1316-D *3. Lumino……
